Marka sorgulama · Bülten 456

amd ai nic

ADVANCED MICRO DEVICES, INC.

Tescilli Başvuru no 2024/130997 · 11 Haziran 2024 · vekilsiz başvuru

Süreç

  1. Başvuru 11 Haziran 2024
  2. Bültende yayın Resmî Marka Bülteni 456 · 12 Kasım 2024
  3. İtiraz penceresi (2 ay) Son gün 12 Ocak 2025 · kapandı
  4. Tescil Tescil no 2024 130997· Gazete 494 (28 Mart 2025)
  5. Yenileme Koruma 10 yıl: yenileme tarihi Haziran 2034 (son 6 ay içinde başvurulur).

Resmî süreler ve işlemler için TÜRKPATENT esastır; Nomist bilgilendirme aracıdır.

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Sınıflar ve kapsam

Mal ve hizmet listesi

Adaptive interconnect device; adaptive system-on-chip (SoC); cards containing integrated circuits; chip cards; chips (integrated circuits); circuit boards with integrated circuits; computer accelerator board; computer and computer peripheral parts, accessories and components; computer chips; computer hardware for creating, remote access to and communication with local area network (LAN), virtual private network (VPN), and global computer networks; computer hardware for enhancing and providing real-time transfer, transmission, reception, processing and digitizing of audio and video graphics information; computer hardware for the development, and use of local and wide area computer networks; computer hardware subsystems comprised of microprocessor subsystems; microprocessor modules; computer hardware; computer peripheral devices; computer peripherals; computer programs (downloadable software); computer software applications, downloadable; computer software, recorded; data center acceleration cards; data processing unit (DPU); distributed services card (DSC) for networking, security, and storage functions; distributed services card (DSC) for providing software-defined services at the compute edge; downloadable computer software used for programmable services, namely, networking, security, load- balancing, telemetry/analytics and storage across computer; downloadable and recorded computer software for programmable data processing unit (DPU) optimized to execute a software stack delivering cloud, compute, network, storage, and security services at cloud scale; electronic chip for integrated circuits; electronic chips; electronic integrated circuits; equipment for communication network; integrated artificial intelligence engine, namely, computer hardware; integrated circuit chip sets; integrated circuit chips; integrated circuits; integrated circuits and circuit boards for use with computer networks and workstations, data recording and storage media for use with computers; integrated circuit modules, boards and cards; peripheral component interconnect (PCI) card for use with a graphic processing unit (GPU) to scale for artificial intelligence training pods and clusters in ethernet technology; programmable data processing unit (DPU); programmable integrated circuits; programmable secure centralized distributed services platform for managing clusters in ethernet technology and infrastructure policy; recorded computer software used for programmable services, namely, networking, security, load-balancing, telemetry/analytics and storage across computer; semiconductors; semiconductor devices; semiconductor integrated circuits; semiconductor processors; software programmable processors.

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