stpay-topaz
STMICROELECTRONICS INTERNATIONAL N.V.
Bu marka senin mi?
Her yeni bülten taranır; benzer bir başvuru bulununca haber veririz. İlk marka ücretsiz.
Markanı ücretsiz izleSüreç
- Başvuru 4 Mart 2024
- Bültende yayın Resmi Marka Bülteni 447 · 27 Haziran 2024
- İtiraz penceresi (2 ay) Son gün 27 Ağustos 2024 · kapandı
- Tescil Tescil no 2024 053793· Gazete 496 (31 Temmuz 2025)
- Yenileme Koruma 10 yıl: yenileme tarihi Mart 2034 (son 6 ay içinde başvurulur).
Resmi süreler ve işlemler için TÜRKPATENT esastır; Nomist bilgilendirme aracıdır.
Sınıflar ve kapsam
Mal ve hizmet listesi
Chips [integrated circuits]; electric or electronic components, namely semiconductors; electronic circuits; microcircuits; integrated circuits; smart integrated circuits; integrated circuits chips; printed electronic circuits for integrated circuit apparatus and cards bearing integrated circuits; electrical or electronic circuits, namely protection circuits; electric or electronic components, namely semiconductors related to contactless payment solution; electric or electronic components, namely chips [integrated circuits] related to contactless payment; electric or electronic components, namely semiconductors related to contactless financial transactions; electric or electronic components, namely chips [integrated circuits] related to contactless financial transactions; electric or electronic components, namely chips [integrated circuits]; near-field communication technology chips [integrated circuits]; near-field communication technology chips [integrated circuits] used in the field of contactless payment solution; near-field communication technology chips [integrated circuits] used in the field of contactless financial transactions; near-field communication technology chips [integrated circuits] used in the field of mobile ticketing; cryptography software; secure integrated circuits; software solution in the field of contactless financial transactions; software solution in the field of contactless payment solution; software; application software, software applications.Engineering services in the field of contactless payment solution; engineering services in the field of financial transactions; design of chips [integrated circuits] for others; design of chips [integrated circuits] related to contactless payment solution; design of near-field communication technology chips [integrated circuits]; design of software solutions in the field of contactless payment solution; data encryption services.
Aynı bültende benzer başvurular
Bülten 447 içindeki 620 aynı-sınıf başvuru arasında Nomist'in benzerlik algoritmasına takılan yok.
Yeni bir marka mı düşünüyorsun?
Marka adayını ücretsiz sorgula; benzerlerini, sınıflarını ve resmi ücreti başvurmadan önce raporda gör.